Description
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision H contains over 200 new or revised terms, including new terminology for ball grid array and chip scale packaging, via protection, conductor patterns, assembly processes, base materials and selective plating processes. Also includes commonly used industry acronyms and an index of terms by technology types for easy searching.
Product Details
- Edition:
- 9th
- Published:
- 07/01/2008
- Number of Pages:
- 152
- File Size:
- 1 file , 5.1 MB
