Description
Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision D incorporates resistance requirements to lead free soldering processes.
Product Details
- Published:
- 04/01/2007
- ANSI:
- ANSI Approved
- Number of Pages:
- 16
- File Size:
- 1 file , 260 KB
