Description
This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. A test method for the resistance to dissolution/dewetting of metallization is also included in the standard. Intended for use by both vendors and users, J-STD-002D was developed by EIA, IPC and JEDEC.
Product Details
- Published:
- 06/01/2013
- Number of Pages:
- 64
- File Size:
- 1 file , 2 MB
