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JEDEC JS 9703

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IPC/JEDEC-9703: Mechanical Shock Test Guidelines for Solder Joint Reliability
standard by JEDEC Solid State Technology Association, 03/01/2009

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Description

This document establishes mechanical shock test guidelines for assessing solder joint reliability of Printed Circuit Board (PCB) assemblies from system to component level.

Product Details

Published:
03/01/2009
Number of Pages:
46
File Size:
1 file , 3.7 MB