Description
The purpose of this test method is to provide a means for determining the moisture sorption properties of organic materials used in the packaging of electronic devices.
This standard details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of electronic devices. These two material properties are important parameters for the effective reliability performance of plastic packaged surface mount devices after exposure to moisture and subjected to high temperature solder reflow.
Product Details
- Published:
- 01/01/2022
- Number of Pages:
- 19
- File Size:
- 1 file , 600 KB
- Note:
- This product is unavailable in Belarus, Russia, Ukraine
