Description
Single-sided (4 up) pattern used for evaluating interaction of solder flux & solder paste residues on printed boards. The board contains 4 comb patterns with .4 mm lines & .5 mm spaces. (2 pcs 30 x 45 cm 1:1) Film.
$70.50
Surface Insulation Resistance
standard by Association Connecting Electronics Industries,
Single-sided (4 up) pattern used for evaluating interaction of solder flux & solder paste residues on printed boards. The board contains 4 comb patterns with .4 mm lines & .5 mm spaces. (2 pcs 30 x 45 cm 1:1) Film.