Description

This part of IEC 62899 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.

Product Details

Edition:

1.0

Published:

08/01/2023

ISBN(s):

9782832273289

Number of Pages:

18

File Size:

1 file , 670 KB

Note:

This product is unavailable in Ukraine, Russia, Belarus