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IEC 62769-4 Ed. 3.0 b:2023

$227.50

Field Device Integration (FDI) – Part 4: FDI Packages
standard by International Electrotechnical Commission, 04/01/2023

Description

This part of IEC 62769 specifies the FDI®1 Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.

Product Details

Edition:
3.0
Published:
04/01/2023
ISBN(s):
9782832267943
Number of Pages:
186
File Size:
1 file , 3 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus