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BS PD IEC TR 62878-2-7:2019

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Device embedding assembly technology. Guidelines. Accelerated stress testing of passive embedded circuit boards
standard by BSI Group, 04/01/2019

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Description

BS PD IEC TR 62878-2-7:2019 describes the accelerated stress testing of passive embedded circuitboards. It can be used for screening finished boards, including multilayer and high-densityinterconnection (HDI) boards. These boards are mainly for mobile devices.

Cross References:
IEC 60194

All current amendments available at time of purchase are included with the purchase of this document.

Product Details

Published:
04/01/2019
ISBN(s):
9780539033595
Number of Pages:
14
File Size:
1 file , 2.5 MB
Product Code(s):
30388756, 30388756, 30388756
Note:
This product is unavailable in United Kingdom