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BS PD IEC/TS 62647-4:2018

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Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Ball grid array (BGA) re-balling
standard by BSI Group, 04/25/2018

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Description

BS PD IEC/TS 62647-4:2018, which is a Technical Specification, defines the requirements forreplacing solder balls on ball grid array (BGA) component packages in the context of anelectronic components management plan (ECMP) for aerospace, defence and high reliabilityproducts.

Cross References:
IEC 62668
IEC TR 61340-5-2
JEDEC JESD625
IPC J-STD-004
IPC-TM-650 number 2.3.25
ECA/IPC/JEDEC J-STD-075
JEDEC JESD22-B117
IPC J-STD-005
IPC/JEDEC J-STD-020
IPC/JEDEC J-STD-033
JEDEC JESD22-B107
AEC-Q100-010
ANSI/ESD S20.20
IEC 62090
IPC J-STD-002
JEDEC JESD22-B101
IPC J-STD-001xS
IPC J-STD-001
MIL-STD-883
IPC/JEDEC J-STD-035
SAE AS5553
JEDEC JESD213
JEDEC JESD22-A101
IEC 61340-5-1
JEDEC J-STD-046
IEC TS 62647-21:2013
IEC TS 62668-1:2016
IEC TS 62647-2:2012
IEC TS 62647-22:2013
IEC TS 62647-3:2014
EIA-STD-4899
ISO/IEC 17050-1
MIL-PRF-38535
IEC TS 62647-23
IEC 62647
IPC-7711/7721
IDEA-STD-1010
JEDEC JESD22-B112
MIL-PRF-19500
JEDEC JESD22-A104
AS/EN/JISQ 9100
MIL-PRF-38534
IEC TS 62239-1
IPC-TM-650 number 2.3.28
IEC TS 62668-2
IEC TS 62647-1
JESD22-B108

All current amendments available at time of purchase are included with the purchase of this document.

Product Details

Published:
04/25/2018
ISBN(s):
9780580973345
Number of Pages:
44
File Size:
1 file , 930 KB
Product Code(s):
30355587, 30355587, 30355587
Note:
This product is unavailable in United Kingdom

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