Description

In ASHRAE Technical Committee 9.9’s Thermal Guidelines for Data Processing Environments, the environmental guidelines for IT equipment inlet conditions extended the allowable range up to 85% and 90% relative humidity (RH) and 75°F (24°C) dew point. However, in an unconnected parallel move, international regulators banned the use of lead-based solders within the manufacturing of electronic equipment. The lead-based solder has been replaced with silver-based solder. Unfortunately, silver, unlike lead, is more susceptible to effects of corrosion when exposed to certain environmental conditions. As a result, operating data centers at the higher humidity levels defined in the allowable ranges in Thermal Guidelines can have detrimental effects on electronic equipment reliability.

Product Details

Published:

2014

Number of Pages:

3

File Size:

1 file , 230 KB

Product Code(s):

D-AJ14DecDC

Note:

This product is unavailable in Russia, Belarus