Description
This standard establishes the requirements for the design of printed boards for PC card form factors. Key concepts include bow and twist constraints, heat dissipation considerations, and component placement requirements. It should be used with the IPC-2221.
Product Details
- Published:
- 01/01/1998
- Number of Pages:
- 15
- File Size:
- 1 file , 740 KB
- Product Code(s):
- 2224(D)1
