Description
This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011.
Product Details
- Published:
- 02/01/1998
- Number of Pages:
- 25
- File Size:
- 1 file , 1.2 MB
- Product Code(s):
- 6015(D)1
