Description
This new document provides guides for the design and fabrication of stencils for solder paste andsurface-mount adhesive. This is the first time this important information has been collected andpublished in an industry consensus document. Stencil design for various surface-mounttechnology, as well as mixed technology with through-hole or flip chip components is discussed;this includes overprint, two-print and step stencil designs. A sample order form and a userinspection checklist are also included.
Product Details
- Published:
- 05/01/2000
- Number of Pages:
- 20
- File Size:
- 1 file , 330 KB
- Product Code(s):
- 7525(D)1
