Description
Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specifically addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials.
Product Details
- Published:
- 07/10/1995
- Number of Pages:
- 12
- File Size:
- 1 file , 180 KB
- Part of:
- IPC 9500-K, IPC M109
- Product Code(s):
- 9501(D)1
