Description
This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.
Product Details
- Published:
- 04/01/1999
- Number of Pages:
- 12
- File Size:
- 1 file , 210 KB
- Part of:
- IPC 9500-K, IPC M109
- Product Code(s):
- 9502(D)1
