Description
The purpose of this standard is to identify the moisture sensitivity classification level of passive surface mount devices and through-hole components, subjected to reflow soldering, so that they can be properly packaged, stored, and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation. This standard may be used to determine what classification level should be used for initial reliability qualification.
Product Details
- Published:
- 04/01/1999
- Number of Pages:
- 19
- File Size:
- 1 file , 170 KB
- Part of:
- IPC 9500-K, IPC M109
- Product Code(s):
- 9503(D)1
