Description

This document is another in a series and specifically addresses preconditioning of non-IC components used in electronic assembly. Do the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that the components chosen meet expected reliability requirements after exposure to factory processes. Developed for users and manufacturers, the procedure consists of a set of simulations, for non-IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes, and exposure to often-used cleaning materials.

Product Details

Published:

06/01/1998

ANSI:

ANSI Approved

Number of Pages:

27

File Size:

1 file , 200 KB

Part of:

IPC 9500-K, IPC M109

Product Code(s):

9504(D)1