Description
This single-sided (4 up) pattern is used for evaluating the interaction of solder flux and solder paste residues on printed boards. This board was used in the Phase 3 portion of the test program evaluating alternative technologies used to eliminate CFCs in printed board assembly operations. The board contains four comb patterns with 0.4 mm lines and 0.5 mm spaces. A stencil pattern is also provided (2 pcs 30 x 45 cm 1:1) No components are provided for this artwork. For prefabricated boards, contact IPC for a list of vendors. Gerber Format.
