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IPC A-38

$93.00

Fine Line Round Robin Test Pattern
standard by Association Connecting Electronics Industries, 09/01/1984

Category:

Description

Tests for: peel strength; opens/shorts; density; copper thickness and hole cracks; relliability (after thermal cyccle and shock) hole quality and vibration. (2 pcs. 36 x 43 cm 1:1) Also available in special compensated size for additive process for 0.05 plating outgrowth. (Please specify size) September 1984 artwork. Available in film only.

Product Details

Published:
09/01/1984