Description
This document establishes the requirements and interactions necessary for printed board assembly processes for interconnecting high performance/high pin count IC packages. Includes information on design principles, material selection, board fabrication, assembly technology, testing strategy and reliability expectations based on end-use environments. Co-produced with EIA, MCNC and Sematech.
Product Details
- Published:
- 08/01/1996
- Number of Pages:
- 123
- File Size:
- 1 file , 1.3 MB
- Product Code(s):
- J-013(D)1
