Description
Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision E incorporates requirements for flexible cover materials used as a flexible dielectric protective layer over etched conductors and other conductive features.
Product Details
- Published:
- 12/01/2010
- ISBN(s):
- 1580986803
- ANSI:
- ANSI Approved
- Number of Pages:
- 30
- File Size:
- 1 file , 1.5 MB
