Description
This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and microvia technology. Also includes commonly used industry acronyms.
Product Details
- Published:
- 10/01/2011
- Number of Pages:
- 132
- File Size:
- 1 file , 6.9 MB
