Description
This document summarizes the IPC position on the subject of “halogen-free” materials for the electronics industry. Its initial release was developed over a period of three years and this revision is also the culmination of another three years of work by a team representing every level of the electronics supply chain. This document is applicable to materials for interconnecting electronics including, but not limited to, copper-clad laminates and prepregs, resin coated copper foils, flexible materials and solder masks. This document reflects the state of the information and technology as of May 2007.
Product Details
- Published:
- 08/01/2007
- Number of Pages:
- 33
- File Size:
- 1 file , 420 KB
