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JEDEC JESD235D

$123.50

High Bandwidth Memory (HBM) DRAM (HBM1, HBM2)
standard by JEDEC Solid State Technology Association, 02/01/2021

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Description

The HBM DRAM is tightly coupled to the host compute die with a distributed interface. The interface is divided into independent channels. Each channel is completely independent of one another. Channels are not necessarily synchronous to each other. The HBM DRAM uses a wide-interface architecture to achieve high-speed, low-power operation. The HBM DRAM uses differential clock CK_t/CK_c. Commands are registered at the rising edge of CK_t, CK_c. Each channel interface maintains a 128b data bus operating at DDR data rates. Also available for designer ease of use is HBM Ballout Spreadsheet (Note this version is the latest version for use with JESD235D). Committee item 1797.99L.

Product Details

Published:
02/01/2021
Number of Pages:
213
File Size:
1 file , 4.6 MB