Description
This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs.
Product Details
- Published:
- 10/01/2011
- Number of Pages:
- 36
- File Size:
- 1 file , 2.1 MB
